KPS slim (Patent Pending): Less material consumption and smaller carbon footprint in cold transfer

“With every new refinement we develop, we always ask ourselves: How can we make this even more resource-efficient and environment-friendly than existing solutions? We will be presenting another successful example of this in the form of KPS slim (patent pending). The enhancement of the successful complete solution KPS SX+ is characterized by the significantly reduced thickness of the carrier material, which is now only 6 µm instead of the previous 12 µm. As a result, less waste is generated during production and the lower material usage reduces the carbon footprint – all with improved covering capacity and impressive edge definition, even with recycled, thin or difficult substrates.